The Influence of QFN Package Construction on Solder Joint Durability

Home > Cryptocurrency
By Iamcool in Cryptocurrency
Updated 3 years ago

A case study characterizes solder joint integrity of different BTC constructions in an accelerated lifetime test. The electronics industry has extensively documented the influence of component construction on solder joint integrity. Materials used in the construction of a component package body result in a composite coefficient of thermal expansion (CTE) for the package that may result in the degradation of the package solder joint integrity.

the-influence-of-qfn-package-construction-on-solder-joint-durability