Intel announces node renaming and roadmap to the Angstrom era

Intel CEO Pat Gelsinger hosted an hour-long global 'Intel Accelerated' webcast yesterday evening. There are numerous highlights from the event to discuss, and in our headline you can see that Intel announced plans for a new node naming scheme, sharing a roadmap to 2025+. Other interesting titbits were on the topics of; two new process technologies (RibbonFET and PowerVia), the claimed leadership in 3D packaging (Foveros Omni and Foveros Direct), and news of progress for Intel Foundry Services (IFS) with Qualcomm announced as the first major customer.